MPC5534MVZ66R2 데이터 시트보기 (PDF) - Freescale Semiconductor

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MPC5534MVZ66R2

Microcontroller

Freescale Semiconductor 

Electrical Characteristics

Table 3. Thermal Characteristics (continued)

Num

Characteristic

Symbol

Value

Unit

208 MAPBGA 324 PBGA

6 Junction to Case 5

7 Junction to Package Top 6

Natural Convection

RθJC

°C/W

8

10

ΨJT

°C/W

2

2

1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and

board thermal resistance.

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3 Per JEDEC JESD51-6 with the board horizontal.

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold

plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

6 Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2.

3.2.1 General Notes for Specifications at Maximum Junction Temperature

An estimation of the chip junction temperature, TJ, can be obtained from the equation:

TJ = TA + (RθJA × PD)

where:

TA = ambient temperature for the package (oC)

RθJA = junction to ambient thermal resistance (oC/W)

PD = power dissipation in the package (W)

The supplied thermal resistances are provided based on JEDEC JESD51 series of standards to provide

consistent values for estimations and comparisons. The difference between the values determined on the

single-layer (1s) board and on the four-layer board with two signal layers and a power and a ground plane

(2s2p) clearly demonstrate that the effective thermal resistance of the component is not a constant. It

depends on the construction of the application board (number of planes), the effective size of the board

which cools the component, how well the component is thermally and electrically connected to the planes,

and the power being dissipated by adjacent components.

Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to

connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal

performance. When the clearance between through vias leave the planes virtually disconnected, the

thermal performance is also greatly reduced.

As a general rule, the value obtained on a single layer board is appropriate for the tightly packed printed

circuit board. The value obtained on the board with the internal planes is usually appropriate if the

application board has one oz (35 micron nominal thickness) internal planes, the components are well

separated, and the overall power dissipation on the board is less than 0.02 W/cm2.

MPC5534 Microcontroller Data Sheet, Rev. 0

6

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

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