MSFA0M02X8 데이터 시트보기 (PDF) - Cystech Electonics Corp.
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MSFA0M02X8 Datasheet PDF : 7 Pages
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CYStech Electronics Corp.
DFN3×2 Dimension
Spec. No. : C724X8
Issued Date : 2009.06.12
Revised Date :
Page No. : 7/9
Marking:
Device
Name
Date
Code
8-Lead DFN3×2 Plastic Package
CYStek Package Code: X8
DIM
Inches
Min.
Max.
A 0.0276 0.0354
A1 0.0000 0.0020
b 0.0094 0.0138
c 0.0031 0.0098
D
*0.0118
E
*0.0079
Millimeters
Min.
Max.
0.70
0.90
0.00
0.05
0.24
0.35
0.08
0.25
*3.00
*2.00
DIM
Inches
Min.
Max.
E1
*0.0689
e
*0.0256
L 0.0079 0.0157
L1 0.0000 0.0039
θ1
0°
12°
*: Typical
Millimeters
Min.
Max.
*1.75
*0.65
0.20
0.40
0.00
0.10
0°
12°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MSFA0M02X8
CYStek Product Specification
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