RMBA09501 데이터 시트보기 (PDF) - Fairchild Semiconductor
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RMBA09501 Datasheet PDF : 7 Pages
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Parts List for Test Evaluation Board (RMBA09501-TB, G654188/G654942)
Part
C1, C3
C2, C9
C8
C4, C5, C11, C12
C6, C7
L1
L2
L3
R1
S1, S2
W1
U1
P3
P1, P2
Board
C10
C13, C14
39pF
6.8pF
8.2pF
1000pF
4.7µF
4.7nH
22nH
39nH
10Ω
Value
Size (EIA)
0402
0402
0402
0402
3528
0603
0603
1008
0402
26AWG (0.015" dia) Wire
RMBA09501 PA
Right angle Pin Header
Brass SMA Connectors
FR4
100pF
1.0µF
0603
0805
Vendor(s)
Murata, GRM36COG390J050
Murata, GRM36COG6R8B050
Murata, GRM36COG8R2B50
Murata, GRM36X7R102K050
TDK, C3216X7R102K050
Toko, LL1608-FH4N7S
Toko, LL1608-FH22NK
Coilcraft, 1008HQ-39NTKBC
IMS, RCI-0402-10R0J
Bar or Ni Ribbon Short
Alpha, 2853/1
Fairchild Semiconductor
3M 2340-5211TN
Johnson Components 142-0701-841
Raytheon Dwg# G654626, V1
Murata, GRM36COG101J50
Murata, GRM39Y5V104Z50
Thermal Considerations for Heat Sinking the RMBA09501
The PWB must be prepared with either an embedded
copper slug in the board where the package is to be
mounted or a heat sink should be attached to the backside
of the PWB where the package is to be mounted on the
front side. The slug or the heat sink should be made of a
highly electrically and thermally conductive material such
as copper or aluminum. The slug should be at least the
same thickness as the PWB. In the case of the heat sink, a
small pedestal should protrude through a hole in the PWB
where the package bottom is directly soldered. In either
configuration, the top surface of the slug or the pedestal
should be made coplanar with the package lead mounting
plane i.e., the top surface of the PWB. Use Sn96 solder
(96.5% Sn and 3.5% Ag) at 220°C for 20 seconds or less to
attach the heat sink to the backside of the PWB. Then,
using Sn63, the package bottom should be firmly soldered
to the slug or the pedestal while the pins are soldered to the
respective pads on the front side of the PWB without
causing any stress on the pins. Remove flux completely if
used for soldering.
©2004 Fairchild Semiconductor Corporation
RMBA09501 Rev. C
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