TC1101 데이터 시트보기 (PDF) - Transcom, Inc.
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TC1101 Datasheet PDF : 5 Pages
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CHIP DIMENSIONS
290± 12
D
S
G
S
TC1101
REV6_20070502
250± 12
Units: Micrometers
Chip Thickness: 100
Gate Pad: 55 x 50
Drain Pad: 55 x 50
Source Pad: 55 x 60
TYPICAL SCATTERING PARAMETERS (TA=25 °C) VDS = 2 V, IDS = 10 mA
6
8
.
0
0
.
1
.
0
4.0
S11
2.0
Swp Max
2.0 18GHz
3.0
45.0.0
Mag Max
0.15
1
0
9
5
7
0
1
5
2
0
135
150
2 4 6 80
. . . ..
0 0 0 0 01
100.0
0 0 00 .
. . .. 0
2 3 45 1
165
-180
-0.2
-0.4
6
.
0
-
8
.
0
-
0
.
1
-
0.01-
00..45--
0.3-
0.2-
Swp Min
2GHz
-165
-150
-135 0
0.075
2
1
5
-
0
Per Div
1
-
S12
-
-
7
9
5
0
Swp Max
0
6
18 GHz
45
30
15
0
-15
-30
-45
-
60
Swp Min
2 GHz
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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