TESDL5V0 데이터 시트보기 (PDF) - TSC Corporation
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TESDL5V0 Datasheet PDF : 5 Pages
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Small Signal Product
ORDER INFORMATION (EXAMPLE)
TESDL5V0 RWG
Green compound code
Packing code
Part no.
PACKAGE OUTLINE DIMENSIONS
1005
TESDL5V0/TESDL12V/TESDL24V
Taiwan Semiconductor
DIM.
A
B
C
D
E
Unit (mm)
Min Max
2.40 2.60
1.10 1.30
0.70 0.90
0.50 (Typ.)
1.00 (Typ.)
Unit (inch)
Min Max
0.094 0.102
0.043 0.051
0.028 0.035
0.020 (Typ.)
0.040 (Typ.)
SUGGEST PAD LAYOUT
DIM.
A
B
C
D
Unit (mm)
Typ.
0.70
1.30
1.30
2.70
Unit (inch)
Typ.
0.028
0.051
0.051
0.106
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary depending on application.
MARKING
Part No.
TESDL5V0
TESDL12V
TESDL24V
Marking
E05
E12
E24
Document Number: DS_S1501022
Version: E15
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