33291 데이터 시트보기 (PDF) - Freescale Semiconductor

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33291

Eight-Output Switch with Serial Peripheral Interface I/O

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

Thermal Resistance

Junction-to-Ambient (Natural Convection, Single-Layer Board) (12), (13)

Junction-to-Ambient (Natural Convection, Four-Layer Board) (12), (14)

Junction to Board (15)

RθJA

RθJMA

RθJL

°C/W

68

44

20

Notes

12. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

13. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

14. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

15. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33291

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