UPC339C5 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPC339C5

LOW POWER QUAD COMPARATOR

NEC => Renesas Technology 

µPC339

RECOMMENDED SOLDERING CONDITIONS

The µPC339 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Surface mount device

µPC339G2, µPC339G2(5): 14-pin plastic SOP (5.72 mm (225))

Process

Infrared ray reflow

Vapor Phase Soldering

Wave Soldering

Partial heating method

Conditions

Peak temperature: 230 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 1 time.

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 1 time.

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR30-00-1

VP15-00-1

WS60-00-1

–

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

Through-hold device

µPC339C: 14-pin plastic DIP (762 mm (300))

Process

Wave soldering

(only to leads)

Partial heating method

Conditions

Solder temperature: 260 °C or below,

Flow time: 10 seconds or less.

Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (per each lead.)

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

Data Sheet G11764EJ4V0DS

9

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