FH19S-10S-0.5SH(51) 데이터 시트보기 (PDF) - HIROSE ELECTRIC

부품명

상세내역

제조사

FH19S-10S-0.5SH(51)

0.5mm pitch, 0.9mm above the board, Flexible Printed Circuit & Flexible Flat Cable Connectors

HIROSE ELECTRIC 

BRecommended Temperature Profile

[For FH19 & FH19S Series]

qUsing Typical Solder Paste

5 sec. Max.

HRS test conditions

250

240ç

Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

200

200ç

Part Number: SENSBY NR-2)

Environment

:Room air

150

150ç

160ç

Solder composition

:Paste, 63%Sn/37%Pb

(Senju Metal Industry, Co., Ltd.’s Part

Number: OZ63-201C-50-9)

Test board

:Glass epoxy 45mm∞100mm∞1.6mm thick

100

Land dimensions :0.3mm∞0.8mm

Metal mask

:0.25mm∞0.8mm∞0.1mm thick

50

25ç (60 sec.)

(30 sec.) (20 sec.

60 sec. to 90 sec.

to 30 sec.)

0

Start

60 Preheating 120

Soldering

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

Time (Seconds)

manufacturer for specific recommendations.

qUsing Lead-free Solder paste

250

200

200ç

MAX 250ç

230ç

150

150ç

100

50

25ç (60 sec.) 90 sec. to 120 sec.

(60 sec.)

0

Start

60 Preheating 120 Soldering

Time (Seconds)

HRS test condition

Solder method

Environment

Solder composition

Test board

Land dimensions

Metal mask

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

:Room air

:Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.’s Part

Number:M705-221CM5-42-10.5)

:Glass epoxy 45mm∞100mm∞1.6mm thick

: 0.3mm∞0.8mm

:0.25mm∞0.8mm∞0.1mm

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult tour solder paste and equipment

manufacturer for specific recommendations.

45

Share Link: