HLCP-H100-00000 데이터 시트보기 (PDF) - Avago Technologies
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HLCP-H100-00000 Datasheet PDF : 16 Pages
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Absolute Maximum Ratings
Parameter
Average Power Dissipated per LED Chip
Peak Forward Current per LED Chip
Average Forward Current per LED Chip
DC Forward Current per LED Chip
Reverse Voltage per LED Chip
Operating Temperature Range
Storage Temperature Range
Wave Soldering Temperature
1.6 mm (1/16 inch) below Body
AlGaAs Red
HLCP-X100
Series
37 mW[1]
45 mA[4]
15 mA
15 mA[1]
5V
–20°C to +100°C[7]
HER
HLMP-2300/
2600/29XX
Series
Yellow
HLMP-2400/
2700/2950
Series
135 mW[2]
85 mW[3]
90 mA[5]
60 mA[5]
25 mA
20 mA
30 mA[2]
25 mA[3]
6 V[6]
–40°C to +85°C
–40°C to +85°C
Green
HLMP-2500/
2800/2965
Series
135 mW[2]
90 mA[5]
25 mA
30 mA[2]
–20°C to +85°C
250°C for 3 seconds
Notes:
1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.
2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.
3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20°C, contact your local Avago sales representative.
Electrical/Optical
Characteristics
at
T
A
=
25°C
AlGaAs Red HLCP-X100 Series
Parameter
HLCP-
Luminous Intensity
per Lighting Emitting
Area[1]
A100/D100/E100
B100/C100/F100/G100
H100
Peak Wavelength
Dominant Wavelength[2]
Forward Voltage per LED
Reverse Breakdown Voltage per LED
Thermal Resistance LED Junction-to-Pin
Symbol Min. Typ. Max. Units Test Conditions
IV
3 7.5
6
15
mcd
IF = 3 mA
mcd
λPEAK
λd
VF
VR
RθJ-PIN
12 30
mcd
645
nm
637
nm
1.8 2.2 V
5
15
V
250
°C/W/
LED
IF = 20 mA
IR = 100 µA
6
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