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6R199P(2011) 데이터 시트보기 (PDF) - Infineon Technologies

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6R199P
(Rev.:2011)
Infineon
Infineon Technologies Infineon
6R199P Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Continuous diode forward current
Diode pulse current2)
Reverse diode dv /dt 4)
Symbol Conditions
IS
I S,pulse
T C=25 °C
dv /dt
IPB60R199CP
Value
9.9
51
15
Unit
A
V/ns
Parameter
Symbol Conditions
Values
Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case R thJC
-
Thermal resistance, junction -
ambient
SMD version, device
R thJA on PCB, minimal
-
footprint
SMD version, device
on PCB, 6 cm2 cooling -
area5)
Soldering temperature,
wave- & reflowsolderin allowed
T sold
reflow MSL1
-
-
0.9 K/W
-
62
35
-
-
260 °C
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
Rev. 2.2
V (BR)DSS V GS=0 V, I D=250 µA
V GS(th) V DS=V GS, I D=0.66 mA
600
2.5
I DSS
V DS=600 V, V GS=0 V,
T j=25 °C
-
V DS=600 V, V GS=0 V,
T j=150 °C
-
I GSS
V GS=20 V, V DS=0 V
-
R DS(on)
V GS=10 V, I D=9.9 A,
T j=25 °C
-
V GS=10 V, I D=9.9 A,
T j=150 °C
-
RG
f =1 MHz, open drain
-
-
3
-
10
-
0.18
0.49
2
-V
3.5
1 µA
-
100 nA
0.199
-
-
page 2
2011-12-20

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