MC33797EKR2 데이터 시트보기 (PDF) - Freescale Semiconductor

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MC33797EKR2

Four Channel Squib Driver IC

Freescale Semiconductor 

MAXIMUM RATINGS

MAXIMUM RATINGS

Table 2. Maximum Ratings (1)

All voltages are with respect to ground unless otherwise noted.

Rating

INPUT ELECTRICAL RATINGS

Symbol

Value

Unit

Voltage on VDD

Voltage on Input terminals CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,

R_DIAG, R_LIMIT_X

Voltage on Squib terminals SQB_HI_XX, SQB_LO_XX, SENSE_XX

Voltage on terminals VDIAG_X, VFIRE_XX

ESD Voltage

Human Body Model (2)

Machine Model (3)

Maximum VVFIRE with Pulsed Output (4), (5)

RSQUIB = 2.0 Ω, tON = 0.8 ms, ISQUIB = 2.24 A

RSQUIB = 1.2 Ω, tON = 0.8 ms, ISQUIB = 2.24 A

RSQUIB = 0.1 Ω, tON = 0.60 ms, ISQUIB = 2.24 A

THERMAL RATINGS

Storage Temperature

Junction Temperature Ambient

Continuous (Prior to Squib Deployment)

t ≤ 5.0 ms (Post-Squib Deployment)

Lead Soldering Temperature (6)

Thermal Resistance (Junction-to-Ambient)

OPERATING RATINGS (7)

VDD

VI

VVFIRE_XX

VDIAG_X

VESD1

VESD2

VFPULSE

TSTG

TA

TJCONT

TJDPYD

TSOLDER

RθJ-A

7.0

-0.3 to VDD + 0.3

-0.3 to VVFIRE + 0.3

-0.3 to 35

±2000

±200

35

25

25

155

85

100

300

245

74

V

V

V

V

V

V

°C

°C

°C

°C/W

Low-Side FET Fire Conditions

RSQUIB

2.0 Ω

1.2 Ω

0.1 Ω

tON

2.6 ms

2.6 ms

2.6 ms

ISQUIB

3.0 A

3.0 A

3.0 A

VSQUIBHI

16 V

16 V

16 V

Notes

1. Absolute maximum ratings indicate limits beyond which damage to the device may occur.

2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).

3. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

4. With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.

The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib

driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is

exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the

arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 Ω ±0.15 Ω.

Shorted squib load is 0.1 Ω.

5. Three-squib driver with RSQUIB = 0.1 Ω conditions. Remaining squib driver conditions: RSQUIB = 1.2 Ω, tON = 4.0 ms, ISQUIB = 2.0 A,

VVDIAG_X = VVFIRE_XX = 35 V.

6. Lead soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering. Exceeding these limits

may cause malfunction or permanent damage to the device.

7. Operating ratings indicate conditions for which the device is intended to be functional. For guaranteed specifications and test conditions,

refer to the static and dynamic electrical characteristics tables on the following pages.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33797

5

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