MCF5208CAB166 데이터 시트보기 (PDF) - Freescale Semiconductor

부품명

상세내역

제조사

MCF5208CAB166

ColdFire® Microprocessor

Freescale Semiconductor 

Electrical Characteristics

Table 5. Thermal Characteristics (continued)

Characteristic

Symbol 196MBGA 144MBGA 160QFP 144LQFP Unit

Junction to board

θJB

363

363

403

503 °C/W

Junction to case

θJC

224

224

394

194 °C/W

Junction to top of package

Ψjt

61,5

61,5

121,6

51,7 °C/W

Maximum operating junction temperature

Tj

105

105

105

105

oC

NOTES:

1 θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale

recommends the use of θJmA and power dissipation specifications in the system design to prevent device junction temperatures

from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly

influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be

verified by physical measurement in the customer’s system using the Ψjt parameter, the device power dissipation, and the

method described in EIA/JESD Standard 51-2.

2 Per JEDEC JESD51-6 with the board horizontal.

3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

5 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance

with Psi-JT.

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance

with Psi-JT.

7 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance

with Psi-JT.

MCF5208 ColdFire® Microprocessor Data Sheet, Rev. 1

Freescale Semiconductor

19

Share Link: