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MCP6546 데이터 시트보기 (PDF) - Microchip Technology

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MCP6546
Microchip
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MCP6546 Datasheet PDF : 32 Pages
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MCP6546/6R/6U/7/8/9
5-Lead Plastic Package (LT) (SC-70)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
n
Q1
D
B
1
c
A2
A
A1
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
5
p
.026 (BSC)
5
0.65 (BSC)
Overall Height
A
.031
.043
0.80
1.10
Molded Package Thickness
A2
.031
.039
0.80
1.00
Standoff
A1
.000
.004
0.00
0.10
Overall Width
E
.071
.094
1.80
2.40
Molded Package Width
E1
.045
.053
1.15
1.35
Overall Length
D
.071
.087
1.80
2.20
Foot Length
L
.004
.012
0.10
0.30
Top of Molded Pkg to
Lead Shoulder
Q1
.004
.016
0.10
0.40
Lead Thickness
c
.004
.007
0.10
0.18
Lead Width
B
.006
.012
0.15
0.30
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
Revised 07-19-05
© 2006 Microchip Technology Inc.
DS21714E-page 19

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