MRF1550FNT1(2006) 데이터 시트보기 (PDF) - Freescale Semiconductor
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MRF1550FNT1
(Rev.:2006)
(Rev.:2006)
Freescale Semiconductor
MRF1550FNT1 Datasheet PDF : 13 Pages
| |||
B
r1
4X b2
4
aaa M D A
D1
aaa M D A
2X b1
5
aaa M D A
6
4X
b3
PACKAGE DIMENSIONS
E1
A
1
DRAIN ID
2
D
4X
e
3
6
5
4
ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ
DRAIN ID
NOTE 6
3
2
1
DATUM
PLANE
H
Y
E
C
SEATING
PLANE
A
E2
Y
D SEATING
PLANE
L
A1
q
A2
c1
STYLE 1:
PIN 1. SOURCE (COMMON)
2. DRAIN
3. SOURCE (COMMON)
4. SOURCE (COMMON)
5. GATE
6. SOURCE (COMMON)
CASE 1264 - 09
ISSUE K
TO - 272- 6 WRAP
PLASTIC
MRF1550NT1
RF Device Data
Freescale Semiconductor
E2
VIEW Y - Y
NOTES:
1. CONTROLLING DIMENSION: INCH .
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
TOP OF THE PARTING LINE.
4. DIMENSION D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.006 PER SIDE. DIMENSION D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −H−.
5. DIMENSIONS b1 AND b3 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.005 TOTAL IN EXCESS
OF THE b1 AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.
6. CROSSHATCHING REPRESENTS THE EXPOSED
AREA OF THE HEAT SLUG.
INCHES
DIM MIN MAX
A 0.098 0.108
A1 0.000 0.004
A2 0.100 0.104
D 0.928 0.932
D1 0.806 0.814
E 0.296 0.304
E1 0.248 0.252
E2 0.241 0.245
L 0.060 0.070
b1 0.193 0.199
b2 0.078 0.084
b3 0.088 0.094
c1 0.007 0.011
e
0.193 BSC
r1 0.063 0.068
q 0_ 6_
aaa
0.004
MILLIMETERS
MIN MAX
2.49 2.74
0.00 0.10
2.54 2.64
23.57 23.67
20.47 20.68
7.52 7.72
6.30 6.40
6.12 6.22
1.52 1.78
4.90 5.05
1.98 2.13
2.24 2.39
0.18 0.28
4.90 BSC
1.60 1.73
0_ 6_
0.10
MRF1550NT1 MRF1550FNT1
11
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