DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

NAND512-A2C 데이터 시트보기 (PDF) - Numonyx -> Micron

부품명
상세내역
제조사
NAND512-A2C Datasheet PDF : 51 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
NAND512-A2C
2
Memory array organization
Memory array organization
The memory array is made up of NAND structures where 16 cells are connected in series.
The memory array is organized in blocks where each block contains 32 pages. The array is
split into two areas, the main area and the spare area. The main area of the array is used to
store data whereas the spare area is typically used to store Error correction Codes, software
flags or Bad Block identification.
In x8 devices the pages are split into a main area with two half pages of 256 Bytes each and
a spare area of 16 Bytes. In the x16 devices the pages are split into a 256 Word main area
and an 8 Word spare area. Refer to Figure 5: Memory array organization.
Bad blocks
The NAND Flash 528 Byte/ 264 Word Page devices may contain Bad Blocks, that is blocks
that contain one or more invalid bits whose reliability is not guaranteed. Additional Bad
Blocks may develop during the lifetime of the device.
The Bad Block Information is written prior to shipping (refer to Section 7.1: Bad Block
management for more details).
Table 4 shows the minimum number of valid blocks in each device. The values shown
include both the Bad Blocks that are present when the device is shipped and the Bad Blocks
that could develop later on.
These blocks need to be managed using Bad Blocks Management, Block Replacement or
Error Correction Codes (refer to Section 7: Software algorithms).
Table 4. Valid blocks
Density of device
512 Mbits
Min
4016
Max
4096
11/51

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]