PS7801J-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
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120±30 s
SUHKHDWLQJ
KHDWLQJ
to 10 s
to 60 s
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(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Preliminary Data Sheet
7