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SST39VF100 데이터 시트보기 (PDF) - Silicon Storage Technology

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SST39VF100
SST
Silicon Storage Technology SST
SST39VF100 Datasheet PDF : 22 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
1 Mbit Multi-Purpose Flash
SST39LF100 / SST39VF100
Data Sheet
TABLE 4: SOFTWARE COMMAND SEQUENCE
Command
Sequence
Word-Program
Sector-Erase
Chip-Erase
Software ID Entry5,6
Software ID Exit7
Software ID Exit7
1st Bus
Write Cycle
Addr1 Data2
5555H AAH
5555H AAH
5555H AAH
5555H AAH
XXH F0H
5555H AAH
2nd Bus
Write Cycle
Addr1 Data2
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
2AAAH 55H
3rd Bus
Write Cycle
Addr1 Data2
5555H A0H
5555H 80H
5555H 80H
5555H 90H
5555H F0H
4th Bus
Write Cycle
Addr1 Data2
WA3 Data
5555H AAH
5555H AAH
5th Bus
Write Cycle
Addr1 Data2
2AAAH 55H
2AAAH 55H
1. Address format A14-A0 (Hex), Addresses A15 can be VIL or VIH, but no other value, for the Command sequence
2. DQ15 - DQ8 can be VIL or VIH, but no other value, for the Command sequence
3. WA = Program word address
4. SAX for Sector-Erase; uses A15-A11 address lines
5. The device does not remain in Software Product ID Mode if powered down.
6. With A15-A1 =0; SST Manufacturers ID= 00BFH, is read with A0 = 0,
SST39LF100/SST39VF100 Device ID = 2788H, is read with A0 = 1
7. Both Software ID Exit operations are equivalent
6th Bus
Write Cycle
Addr1 Data2
SAX4 30H
5555H 10H
T4.4 363
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under Absolute Maximum
Stress Ratingsmay cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD + 1.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE: SST39LF100
Range
Commercial
Ambient Temp
0°C to +70°C
VDD
3.0-3.6V
OPERATING RANGE: SST39VF100
Range
Commercial
Industrial
Ambient Temp
0°C to +70°C
-40°C to +85°C
VDD
2.7-3.6V
2.7-3.6V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for SST39LF100
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for SST39VF100
See Figures 11 and 12
©2001 Silicon Storage Technology, Inc.
6
S71129-02-000 6/01 363

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