LTM8046Y 데이터 시트보기 (PDF) - Linear Technology
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LTM8046Y Datasheet PDF : 20 Pages
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LTM8046
Absolute Maximum Ratings
(Note 1)
VIN, RUN....................................................................32V
FB, SS..........................................................................5V
VOUT Relative to VOUT–...............................................16V
VIN + 2VOUT (Note 5)..................................................36V
BIAS................................................................. VIN + 0.1V
GND to VOUT– Isolation (Note 2)............................2kVAC
Maximum Internal Temperature (Note 3)............... 125°C
Peak Solder Reflow Body Temperature.................. 245°C
Pin Configuration
TOP VIEW
A
BANK 4
VOUT B
C
D
BVAONUKT–3
E
F
G
H
J
BANK 1
VIN
K
L
BANK 2
GND
RUN BIAS SS FB
1234567
BGA PACKAGE
51-LEAD (15mm × 9mm × 4.92mm)
TJMAX = 125°C, θJA = 21.9°C/W, θJCbottom = 7.9°C/W, θJCtop = 17.9°C/W, θJB = 8.4°C/W
WEIGHT = 1.5g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12
Order Information
PART NUMBER
LTM8046EY#PBF
LTM8046IY#PBF
LTM8046IY
LTM8046MPY#PBF
LTM8046MPY
PAD OR BALL FINISH
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
PART MARKING*
DEVICE
FINISH CODE
LTM8046Y
e1
LTM8046Y
e1
LTM8046Y
e0
LTM8046Y
e1
LTM8046Y
e0
PACKAGE
TYPE
BGA
BGA
BGA
BGA
BGA
MSL
RATING
3
3
3
3
3
TEMPERATURE RANGE
(See Note 3)
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
8046fb
2
For more information www.linear.com/LTM8046
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