HMC833LP6G 데이터 시트보기 (PDF) - Hittite Microwave

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HMC833LP6G

FRACTIONAL-N PLL WITH INTEGRATED VCO 25 - 6000 MHz

Hittite Microwave 

HMC833LP6GE

v03.714

FRACTIONAL-N PLL WITH INTEGRATED VCO

25 - 6000 MHz

Absolute Maximum Ratings

AVDD, RVDD, DVDD3V, VCCPD,

VCCHF, VCCPS

-0.3V to +3.6V

VPPCP, VDDLS, VCC1,VCC2

-0.3V to +5.5V

Operating Temperature

-40°C to +85°C

Storage Temperature

-65°C to 150°C

Maximum Junction Temperature

150 °C

Thermal Resistance (RTH)

(junction to ground paddle)

9 °C/W

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

40 sec

ESD Sensitivity (HBM)

Class 1B

Recommended Operating Conditions

Parameter

Temperature

Junction Temperature

Ambient Temperature

Supply Voltage

AVDD, RVDD, DVDD3V, VCCPD, VCCHF, VCCPS

VPPCP

Outline Drawing

Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device.

This is a stress rating only; functional operation of the

device at these or any other conditions above those

indicated in the operational section of this specification

is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device

reliability.

Condition

Min.

Typ.

Max.

Units.

125

°C

-40

85

°C

3.0

3.3

3.5

V

4.8

5.0

5.2

V

7 - 11

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.25mm MAX.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.

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Trademarks and registered trademarks aArepthpelpircopaetrityoonf thSeiur rpesppeoctrivte: oPwhneorsn. e: 978-250-33A4p3plicoartioanpSpusp@pohrti:tPtihteo.nceo: 1m-800-ANALOG-D

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