EMIF02-MIC02F2(2008) 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF02-MIC02F2
(Rev.:2008)

2-line IPAD™, EMI filter and ESD protection

STMicroelectronics 

Ordering information

EMIF02-MIC02F2

Figure 13. Footprint

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

Figure 14. Marking

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 15. Flip Chip tape and reel specification

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

1.02

0.73 ± 0.05

All dimensions in mm

4 ± 0.1

User direction of unreeling

5

Note:

Ordering information

Table 3. Ordering information

Order code

Marking

Package

EMIF02-MIC02F2

FJ

Flip Chip

Weight

2.3 mg

Base qty

5000

Delivery mode

Tape and reel 7”

More information is available in the application notes:

AN1235:"Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

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