MP03/130-16 데이터 시트보기 (PDF) - Dynex Semiconductor
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MP03/130-16 Datasheet PDF : 10 Pages
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MP03 XXX 130 Series
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
VGT
IGT
VGD
V
FGM
V
FGN
VRGM
IFGM
P
GM
PG(AV)
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Conditions
V = 5V, T = 25oC
DRM
case
V = 5V, T = 25oC
DRM
case
VDRM = 5V, Tcase = 25oC
Anode positive with respect to cathode
Typ. Max. Units
- 3.0 V
- 200 mA
- 0.2 V
-
30
V
Anode negative with respect to cathode - 0.25 V
- 5.0 V
Anode positive with respect to cathode
-
4
A
-
16 W
-
3
W
ORDERING INSTRUCTIONS
Part number is made up as follows:
Examples:
MP03 HBT 130 - 18
MP
03
HBT
130
18
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at Tcase = 75oC
= VRRM/100
MP03 HBP130-16
MP03 HBN130-20
MP03 HBT130-16
Note: Diode ratings and characteristics are comparable with SCR in types HBP or HBN.
Types HBP or HBN can also be supplied with diode polarity reversed, to special order.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of V and r
T(TO)
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink if
required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to remove
oxide build up and foreign material. Care should be taken to
ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
After application of thermal compound, place the module squarely
over the mounting holes, (or 'T' slots) in the heatsink. Using a
torque wrench, slowly tighten the recommended fixing bolts at
each end, rotating each in turn no more than 1/4 of a revolution at
a time. Continue until the required torque of 5Nm (44lb.ins) is
reached at both ends.
It is not acceptable to fully tighten one fixing bolt before starting to
tighten the others. Such action may DAMAGE the module.
3/10
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