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74LVC1G07SS 데이터 시트보기 (PDF) - Diodes Incorporated.

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74LVC1G07SS
Diodes
Diodes Incorporated. Diodes
74LVC1G07SS Datasheet PDF : 16 Pages
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Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol Parameter
Test Conditions
VOL
II
IOFF
ICC
ΔICC
Ci
Low Level
Output Voltage
Input Current
Power Down
Leakage
Current
Supply Current
Additional
Supply Current
Input
Capacitance
IOL = 100μA
IOL = 4mA
IOL = 8mA
IOL = 12mA
IOL = 16mA
IOL = 24mA
IOL = 32mA
VI = 5.5 V or GND
VI or VO = 5.5V
VI = 5.5V or GND
IO=0
Input at
VCC 0.6 V
Vi = VCC or GND
VCC
1.65V to 5.5V
1.65V
2.3V
2.7V
3V
4.5V
0 to 5.5V
0V
5.5V
3V to 5.5V
3.3V
-40°C to +85°C
Min
Typ
Max
0.1
0.45
0.3
0.4
0.4
0.55
0.55
± 0.1
±5
±10
0.1
10
500
5
74LVC1G07
-40°C to +125°C
Unit
Min
Max
0.1
0.7
0.45
0.6
V
0.6
0.8
.8
± 100
μA
±200
μA
200
μA
5,000
μA
pF
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
θJA
θJC
Parameter
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-Case
Test Conditions
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
VCC
(Note 10)
(Note 10)
Min
Typ
Max
Unit
204
371
231
400
°C/W
435
445
470
460
52
143
105
225
°C/W
250
250
275
265
Note:
10. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
74LVC1G07
Document number: DS32274 Rev. 9 - 2
4 of 16
www.diodes.com
April 2016
© Diodes Incorporated

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