ACPL-4800-000E 데이터 시트보기 (PDF) - Avago Technologies

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ACPL-4800-000E

High CMR Intelligent Power Module and Gate Drive Interface Optocoupler

Avago Technologies 

Solder Reflow Temperature Profile (Gull Wing Surface Mount Option 300 Parts)

300

PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.

REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.

PEAK

TEMP.

245˚C

200

160˚C

150˚C

140˚C

100

2.5˚C ± 0.5˚C/SEC.

3˚C + 1˚C/-0.5˚C

PREHEATING TIME

150˚C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240¡C

SOLDERING

TIME

200˚C

PEAK

TEMP.

230˚C

50 SEC.

ROOM

TEMPERATURE

0

0

TIGHT

TYPICAL

LOOSE

50

100

150

200

250

TIME (SECONDS)

Note: Non-halide flux should be used

Recommended Pb-Free IR Profile

tp

Tp

TL

T smax

T smin

217˚C

150 - 200

260 +0/-5˚C

RAMP-UP

3˚C/SEC. MAX.

˚C

ts

tL

PREHEAT

60 to 180 SEC.

TIME WITHIN 5˚C of ACTUAL

PEAK TEMPERATURE

20-40 SEC.

RAMP-DOWN

6˚C/SEC. MAX.

60 to 150 SEC.

25

t 25˚C to PEAK

TIME (SECONDS)

NOTES:

THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200˚C, Tsmin = 150˚C

Note: Non-halide flux should be used



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