AD8137YCP-R2(2004) 데이터 시트보기 (PDF) - Analog Devices

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AD8137YCP-R2
(Rev.:2004)

Low Cost, Low Power, Differential ADC Driver

Analog Devices 

AD8137

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Supply Voltage

VOCM

Power Dissipation

Input Common-Mode Voltage

Storage Temperature

Operating Temperature Range

Lead Temperature Range

(Soldering 10 sec)

Junction Temperature

Rating

12 V

VS+ to VS−

See Figure 3

VS+ to VS−

−65°C to +125°C

−40°C to +125°C

300°C

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, i.e., θJA is specified

for the device soldered in a circuit board in still air.

Table 5. Thermal Resistance

Package Type

θJA

θJC

SOIC-8/2-Layer

157

56

SOIC-8/4-Layer

125

56

LFCSP/4-Layer

70

56

Unit

°C/W

°C/W

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8137 package is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic will change its properties. Even tempo-

rarily exceeding this temperature limit may change the stresses

that the package exerts on the die, permanently shifting the

parametric performance of the AD8137. Exceeding a junction

temperature of 175°C for an extended period of time can result

in changes in the silicon devices potentially causing failure.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). The load current consists of differential

and common-mode currents flowing to the load, as well as

currents flowing through the external feedback networks and

the internal common-mode feedback loop. The internal resistor

tap used in the common-mode feedback loop places a 1 kΩ

differential load on the output. RMS output voltages should be

considered when dealing with ac signals.

Airflow reduces θJA. Also, more metal directly in contact with

the package leads from metal traces, through holes, ground, and

power planes will reduce the θJA.

Figure 3 shows the maximum safe power dissipation in the

package versus the ambient temperature for the SOIC-8

(125°C/W) and LFCSP (θJA = 70°C/W) package on a JEDEC

standard 4-layer board. θJA values are approximations.

3.0

2.5

LFCSP

2.0

1.5

1.0

SOIC-8

0.5

0

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.

Rev. A | Page 6 of 24

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