AD8205YR 데이터 시트보기 (PDF) - Analog Devices
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AD8205YR Datasheet PDF : 12 Pages
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AD8205
Figure 2. Metallization Diagram
–IN 1
8 +IN
GND 2 AD8205 7 VREF1
VREF2
3
TOP VIEW
(Not to Scale)
6
V+
NC 4
5 OUT
NC = NO CONNECT
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
1
−IN
2
GND
3
VREF2
4
NC
5
OUT
6
V+
7
VREF1
8
+IN
Die size is 1170 µm by 1280 µm.
X
−206
−447
−432
N/A
444
444
456
203
Y
508
57
−457
N/A
−472
−203
434
509
Die thickness is 13 mil.
Minimum passivation opening (minimum bond pad size) is
92 µm × 92 µm.
Passivation type is 8KA USG (Oxide) + 10KA Oxynitride.
Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.
Backside potential is V+.
Rev. 0 | Page 5 of 12
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