Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
ELECTRICAL
AVDD
DRVDD
CWVDD
GND
AVDD
Digital Outputs
(DOUT+, DOUT−, DCO+,
DCO−, FCO+, FCO−)
CLK+, CLK−
LI-x
LO-x
LOSW-x
CWDx−, CWDx+
SDIO, GAIN+,GAIN−
PDWN, STBY, SCLK, CSB
REFT, REFB, RBIAS
VREF, SENSE
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
Maximum Junction
Temperature
Lead Temperature
(Soldering, 10 sec)
Storage Temperature
Range (Ambient)
With
Respect To
GND
GND
GND
GND
DRVDD
GND
GND
LG-x
LG-x
LG-x
GND
GND
GND
GND
GND
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
150°C
300°C
−65°C to +150°C
AD9271
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Air Flow Velocity (m/s)
0.0
1.0
2.5
θJA1
20.3°C/W
14.4°C/W
12.9°C/W
θJB
7.6°C/W
θJC
4.7°C/W
1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION
Rev. PrA | Page 11 of 58