Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter or Pin
VS
RSET
CLK
CLK
OUT0, OUT1, OUT2
FUNCTION
STATUS
Junction Temperature1
Storage Temperature
Lead Temperature (10 sec)
With
Respect
to
Min Max Unit
GND
−0.3 +3.6
V
GND
−0.3 VS + 0.3 V
GND
−0.3 VS + 0.3 V
CLKB
−1.2 +1.2
V
GND
−0.3 VS + 0.3 V
GND
−0.3 VS + 0.3 V
GND
−0.3 VS + 0.3 V
150
°C
−65 +150 °C
300
°C
1 See Thermal Characteristics for θJA.
AD9513
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS1
Thermal Resistance2
32-Lead LFCSP
θJA = 36.6°C/W
1 Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
2 The external pad of this package must be soldered to adequate copper land
on board.
Rev. B | Page 11 of 28