AD9523BCPZ 데이터 시트보기 (PDF) - Analog Devices
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AD9523BCPZ
Analog Devices
AD9523BCPZ Datasheet PDF : 60 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 17.
Parameter
VDD3_PLL1, VDD3_PLL2, VDD3_REF,
VDD3_OUT, LDO_VCO to GND
REFA, REFA, REFIN, REFB, REFB to GND
SCLK/SCL, SDIO/SDA, SDO, CS to GND
OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
OUT3, OUT3, OUT4, OUT4, OUT5,
OUT5, OUT6, OUT6, OUT7, OUT7,
OUT8, OUT8, OUT9, OUT9, OUT10,
OUT10, OUT11, OUT11, OUT12,
OUT12, OUT13, OUT13 to GND
SYNC, RESET, PD to GND
STATUS0, STATUS1 to GND
SP0, SP1, EEPROM_SEL to GND
VDD1.8_OUT, LDO_PLL1, LDO_PLL2 to
GND
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (10 sec)
Rating
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
2V
−40°C to +85°C
115°C
−65°C to +150°C
300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD9523
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 18. Thermal Resistance
Package
Type
Airflow
Velocity
(m/sec)
θJA1, 2
72-Lead LFCSP, 0
21.3
10 mm ×
1.0
20.1
10 mm
2.5
18.1
θJC1, 3
1.7
θJB1, 4
12.6
ΨJT1, 2
0.1
0.2
0.3
Unit
°C/W
°C/W
°C/W
1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
For information about power dissipation, refer to the Power
Dissipation and Thermal Considerations section.
ESD CAUTION
Rev. D | Page 11 of 60
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