Recommended Underfill Type and Characteristic
• Henkel FP4548
• Low moisture absorption
• Low CTE
• Underfill up to 70-85% of height
Height
70 ~ 85%
Underfill PCB
Recommended PCB land pad design
• NiAu flash over copper pad
• Pad Diameter (C)= 0.20 mm
• NSMD Diameter (D)= 0.25 ~ 0.30 mm
NSMD
Recommended stencil design
• Stencil thickness
5 mils
• Stencil type Ni Electroforming
• Stencil Aperture Type Square
• Stencil Aperture
310 um
• Additional Feature Rounded square edge
310 um
560 um
After soldering or mounting precaution
Please ensure that all soldered or reflowed CSP package
that is mounted on the PCB is not exposed to compres-
sion or loading force directly perpendicular to the flat top
surface.
Precaution:
Excessive loading force directly perpendicular to the flat
top surface may cause pre-mature failure.
Loading Force
PCB
13