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ADJD-S311-CR999 데이터 시트보기 (PDF) - Avago Technologies

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ADJD-S311-CR999
AVAGO
Avago Technologies AVAGO
ADJD-S311-CR999 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Recommended Underfill Type and Characteristic
Henkel FP4548
Low moisture absorption
Low CTE
Underfill up to 70-85% of height
Height
70 ~ 85%
Underfill PCB
Recommended PCB land pad design
NiAu flash over copper pad
Pad Diameter (C)= 0.20 mm
NSMD Diameter (D)= 0.25 ~ 0.30 mm
NSMD
Recommended stencil design
Stencil thickness
5 mils
Stencil type Ni Electroforming
Stencil Aperture Type Square
Stencil Aperture
310 um
Additional Feature Rounded square edge
310 um
560 um
After soldering or mounting precaution
Please ensure that all soldered or reflowed CSP package
that is mounted on the PCB is not exposed to compres-
sion or loading force directly perpendicular to the flat top
surface.
Precaution:
Excessive loading force directly perpendicular to the flat
top surface may cause pre-mature failure.
Loading Force
PCB
13

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