OUTLINE DIMENSIONS
4.00
BSC SQ
0.60
MAX
PIN 1
INDICATOR
TOP
VIEW
3.75
BCS SQ
0.60
MAX
16
20
15
1
EXPOSED
PAD
(BOTTOM VIEW)
12° MAX
0.90
0.85
0.80
SEATING
PLANE
0.50
BSC
0.80 MAX
0.65 TYP
0.20
REF
0.75
11
10
0.55
0.35
0.05 MAX
0.02 NOM
COPLANARITY
0.08
5
6
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 20. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body
(CP-20)
Dimensions shown in millimeters
2.25
2.10 SQ
1.95
0.25 MIN
ADM8832
ORDERING GUIDE
Model
ADM8832ACP
ADM8832ACP-REEL
ADM8832ACP-REEL7
ADM8832ACPZ1
ADM8832ACPZ-REEL1
ADM8832ACPZ-REEL71
1 Z = Pb-free part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Package Option
CP-20
CP-20
CP-20
CP-20
CP-20
CP-20
Rev. A | Page 11 of 12