ADP120 데이터 시트보기 (PDF) - Analog Devices
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ADP120 Datasheet PDF : 20 Pages
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In cases where the board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction
temperature rise. Maximum junction temperature (TJ) is
calculated from the board temperature (TB) and power
dissipation (PD) using the formula
TJ = TB + (PD × ΨJB)
(5)
140
MAX JUNCTION TEMPERATURE
120
IL = 100mA
IL = 75mA IL = 50mA
100
80
IL = 25mA IL = 10mA
IL = 1mA
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 46. TSOT, TB = 85°C
140
MAX JUNCTION TEMPERATURE
120
IL = 100mA
IL = 75mA IL = 50mA
100
80
IL = 25mA
IL = 10mA
IL = 1mA
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 47. WLCSP, TB = 85°C
ADP120
PCB LAYOUT CONSIDERATIONS
Improve heat dissipation from the package by increasing the
amount of copper attached to the pins of the ADP120. However,
as listed in Table 6, a point of diminishing returns is eventually
reached, beyond which an increase in the copper size does not
yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402- or 0603-size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
GND
ANALOG DEVICES
ADP120-xx-EVALZ
GND
C1
C2
U1
J1
VIN
VOUT
GND
EN
Figure 48. TSOT PCB Layout
GND
ADP120CB-xx-EVALZ J1
VIN
VOUT
C1
C2
U1
WLC
SP
GND
EN
GND
Figure 49. WLCSP PCB Layout
Rev. A | Page 17 of 20
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