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ADP3120 데이터 시트보기 (PDF) - Analog Devices

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ADP3120 Datasheet PDF : 16 Pages
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ADP3120
APPLICATION INFORMATION
SUPPLY CAPACITOR SELECTION
For the supply input (VCC) of the ADP3120, a local bypass
capacitor is recommended to reduce the noise and to supply
some of the peak currents drawn. Use a 4.7 μF, low ESR
capacitor. Multilayer ceramic chip (MLCC) capacitors provide
the best combination of low ESR and small size. Keep the
ceramic capacitor as close as possible to the ADP3120.
BOOTSTRAP CIRCUIT
The bootstrap circuit uses a charge storage capacitor (CBST)
and a diode, as shown in Figure 1. These components can be
selected after the high-side MOSFET has been chosen. The
bootstrap capacitor must have a voltage rating that can handle
twice the maximum supply voltage. A minimum 50 V rating is
recommended. The capacitor values are determined using the
following equations:
C BST1
+
C
BST2
=
10 ×
QGATE
VGATE
(1)
C BST1
= VGATE
(2)
CBST1 + CBST2 VCC VD
where:
QGATE is the total gate charge of the high-side MOSFET at VGATE.
VGATE is the desired gate drive voltage (usually in the range of
5 V to 10 V, 7 V being typical).
VD is the voltage drop across D1.
Rearranging Equation 1 and Equation 2 to solve for CBST1 yields
C
BST1
=
10
×
QGATE
VCC VD
CBST2 can then be found by rearranging Equation 1:
C
BST2
=
10 ×
QGATE
VGATE
CBST1
For example, an NTD60N02 has a total gate charge of about
12 nC at VGATE = 7 V. Using VCC = 12 V and VD = 1 V, one finds
CBST1 = 12 nF and CBST2 = 6.8 nF. Good quality ceramic capacitors
should be used.
RBST is used to limit slew rate and to minimize the ringing at the
switch node. It also provides peak current limiting through D1.
An RBST value of 1.5 Ω to 2.2 Ω is a good choice. The resistor
needs to handle at least 250 mW due to the peak currents that
flow through it.
A small-signal diode can be used for the bootstrap diode due
to the ample gate drive voltage supplied by VCC. The bootstrap
diode must have a minimum 15 V rating to withstand the
maximum supply voltage. The average forward current can
be estimated by
I F(AVG) = QGATE × f MAX
(3)
where fMAX is the maximum switching frequency of the
controller. The peak surge current rating should be calculated
using
I F(PEAK )
=
VCC VD
RBST
(4)
MOSFET SELECTION
When interfacing the ADP3120 to external MOSFETs, the
designer should consider ways to make a robust design that
minimizes stresses on both the driver and the MOSFETs. These
stresses include exceeding the short-time duration voltage
ratings on the driver pins as well as the external MOSFET.
It is also highly recommended to use the boot-snap circuit to
improve the interaction of the driver with the characteristics of
the MOSFETs. If a simple bootstrap arrangement is used, make
sure to include a proper snubber network on the SW node.
HIGH-SIDE (CONTROL) MOSFETS
A high-side, high speed MOSFET is usually selected to
minimize switching losses (see the ADP3186 or ADP3188
data sheet for Flex-Mode1 controller details). This typically
implies a low gate resistance and low input capacitance/charge
device. Yet, a significant source lead inductance can also exist.
This depends mainly on the MOSFET package; it is best to
contact the MOSFET vendor for this information.
The ADP3120 DRVH output impedance and the input resistance
of the MOSFETs determine the rate of charge delivery to the
internal capacitance of the gate. This determines the speed at
which the MOSFETs turn on and off. However, because of
potentially large currents flowing in the MOSFETs at the on and
off times (this current is usually larger at turn off due to ramping
up of the output current in the output inductor), the source lead
inductance generates a significant voltage when the high-side
MOSFETs switch off. This creates a significant drain-source
voltage spike across the internal die of the MOSFETs and can
lead to a catastrophic avalanche. The mechanisms involved in
this avalanche condition can be referenced in literature from the
MOSFET suppliers.
1 Flex-Mode™ is protected by U.S. Patent 6683441.
Rev. 0 | Page 10 of 16

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