ADP7105(Rev0) 데이터 시트보기 (PDF) - Analog Devices
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ADP7105 Datasheet PDF : 28 Pages
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ADP7105
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VOUT 1
SENSE/ADJ 2
GND 3
SS 4
ADP7105
TOP VIEW
(Not to Scale)
8 VIN
7 PG
6 GND
5 EN/UVLO
NOTES
1. IT IS HIGHLY RECOMMENDED THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNECTED TO THE GROUND
PLANE ON THE BOARD.
Figure 3. Pin Configuration, LFCSP Package
VOUT 1
8 VIN
SENSE/ADJ 2 ADP7105 7 PG
GND
3
TOP VIEW
(Not to Scale)
6
GND
SS 4
5 EN/UVLO
NOTES
1. IT IS HIGHLY RECOMMENDED THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNECTED TO THE GROUND
PLANE ON THE BOARD.
Figure 4. Pin Configuration, Narrow-Body SOIC Package
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
1
VOUT
2
SENSE/ADJ
3
GND
4
SS
5
EN/UVLO
6
GND
7
PG
8
VIN
EPAD
Description
Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.
Sense (SENSE). SENSE measures the actual output voltage at the load and feeds it to the error
amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop
between the regulator output and the load. This function applies to fixed voltage models only.
Adjust Input (ADJ). An external resistor divider sets the output voltage. This function applies to
adjustable voltage models only.
Ground.
Soft Start. A capacitor connected to this pin determines the soft start time.
Enable Input (EN). Drive EN high to turn on the regulator; drive EN low to turn off the regulator.
For automatic startup, connect EN to VIN.
Programmable Undervoltage Lockout (UVLO). When the programmable UVLO function is used,
the upper and lower thresholds are determined by the programming resistors.
Ground.
Power Good. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the
part is in shutdown mode, current-limit mode, or thermal shutdown, or if VOUT falls below 90%
of the nominal output voltage, PG immediately transitions low. If the power-good function is
not used, the pin can be left open or connected to ground.
Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
Exposed Pad. The exposed pad on the bottom of the package enhances thermal performance
and is electrically connected to GND inside the package. It is highly recommended that the
exposed pad be connected to the ground plane on the board.
Rev. 0 | Page 6 of 28
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