AOZ1013 데이터 시트보기 (PDF) - Alpha and Omega Semiconductor
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AOZ1013 Datasheet PDF : 14 Pages
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AOZ1013
The maximum junction temperature of AOZ1013 is
145°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1013 under different ambient
temperatures.
The thermal performance of the AOZ1013 is strongly
affected by the PCB layout. Extra care should be taken
by users during the design process to ensure that the IC
will operate under the recommended environmental
conditions.
Several layout tips are listed below for the best electric
and thermal performance. Figure 3 below illustrates a
PCB layout example as a reference.
1. Do not use thermal relief connection to the VIN and
the PGND pin. Pour a maximized copper area to
the PGND pin and the VIN pin to help thermal
dissipation.
2. Input capacitor should be connected to the VIN pin
and the PGND pin as close as possible.
3. A ground plane is preferred. If a ground plane is not
used, separate PGND from AGND and connect them
only at one point to avoid the PGND pin noise
coupling to the AGND pin.
4. Make the current trace from LX pins to L to Co to the
PGND as short as possible.
5. Pour copper plane on all unused board area and
connect it to stable DC nodes, like VIN, GND, or
VOUT.
6. The two LX pins are connected to the internal PFET
drain. They are low resistance thermal conduction
path and most noisy switching node. Connect a
copper plane to the LX pin to help thermal
dissipation. This copper plane should not be too
large otherwise switching noise may be coupled to
other parts of the circuit.
7. Keep sensitive signal traces away from the LX pins.
L
Cin
VIN 1
8
PGND 2 SO-8 7
AGND 3
6
FB 4
5
LX
LX
EN
COMP
Cout
Cc Rc
Figure 3. AOZ1013 PCB Layout
Rev. 1.2 October 2009
www.aosmd.com
Page 11 of 14
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