APL5101-12AI-TRG 데이터 시트보기 (PDF) - Anpec Electronics

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APL5101-12AI-TRG

150mA, 4mA Quiescent Current Regulator

Anpec Electronics 

APL5101/2

Application Information

Capacitor Selection and Regulation Stability

The APL5101/2 use at least a 1µF capacitor on the input.

This capacitor can use Aluminum, Tantalum or Ceramic

capacitors. Input capacitor with large value and low ESR

provides better PSRR and line transient response. The

output capacitor also can use Aluminum, Tantalum or

Ceramic capacitor, and its proper values is recommended

1µF, ESR must be above 10mΩ Large output capacitor

values can reduce noise and improve load-transient

response, stability, and PSRR. W ith X5R and Y5V

dielectrics, 1µF is sufficient at all operating temperatures.

The selection of output capacitor is important because it with

COUT forms a zero to provide the sufficient phase margin.

Input-Output (Dropout) Voltage

The minimum input-output voltage differential (dropout)

determines the lowest usable supply voltage. The drop-

out voltage is the function of drain-to-source on resis-

tance multiplied by the load current.

Current Limit and Short Circuit

APL5101/2 include a current-limit circuitry for this lin-

ear regulator. The current limit protection, which sense

the current flows the P-channel MOSFET, and controls

the output voltage. The point where limiting occurs is

IOUT=300mA. When output is shorted to ground, the

APL5101/2 will keep short circuit current at 50mA.This

design is a method for an indefinite amount of time with-

out damaging to the part.

Thermal Protection

Thermal protection limits total power dissipation in the

APL5101/2. When the junction temperature exceeds TJ =

+135°C, the thermal sensor generate a logic signal to turn

off the pass transistor and let IC to cool. When the IC’s

junction temperature cools by 20°C, the thermal sen-

sor will turn the pass transistor on again, resulting in a

pulsed output during continuous thermal protection. Ther-

mal protection is designed to protect the IC in the event of

fault conditions. For continual operation, the junction tem-

perature do not exceed T =+125oC.

J

Operating Region and Power Dissipation

The thermal resistance of the case and circuit board,

ambient and junction air temperature, and the rate of air

flow all control the APL5101/2’s maximum power

dissipation. The power dissipation across the device is

P = I (V -V ). The maximum power dissipation is:

OUT IN OUT

PMAX = (TJ-TA) / (θJC +θCA )

where TJ-TA is the temperature difference between the

junction and ambient air. θJC is the thermal resistance of

the package, θCA is the thermal resistance through the

printed circuit board, copper traces, and other materials

to the surrounding air. The GND pin provides an electrical

connection to ground and channeling heat away. The

printed circuit board (PCB) forms a heat sink and dissi-

pates most of the heat into ambient air.

Recommanded Minimum Footprint

SOT-23

0.037

0.024

0.074

Unit : Inch

SOT-23-5

0.076

0.038

0.02

Unit : Inch

Copyright © ANPEC Electronics Corp.

9

Rev. A.5 - Jul., 2013

www.anpec.com.tw

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