AS1326(2007) 데이터 시트보기 (PDF) - austriamicrosystems AG
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AS1326 Datasheet PDF : 18 Pages
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AS1326
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max Units
Comments
ON, ONN, OUT, CLK/SEL to GND -0.3
7
V
PGND to GND
-0.3
+0.3
V
REF, FB, ISET, POUT to GND
-0.3
VOUT +
0.3
V
LX to PGND
-0.3
VPOUT +
0.3
V
POUT to OUT
Thermal Resistance ΘJA
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Package Body Temperature
-0.3
+0.3
V
33
ºC/W
on PCB
-40
+85
ºC
-65
+150
ºC
+150
ºC
+260
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
ºC Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
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