AS1101 데이터 시트보기 (PDF) - austriamicrosystems AG
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AS1101 Datasheet PDF : 13 Pages
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AS1101/AS1102/AS1103/AS1104
Data Sheet - Package Drawings and Markings
Figure 21. MSOP-8 Package
Symbol
A
A1
A2
D
D2
E
E1
E2
E3
E4
R
R1
t1
t2
Millimeters
1.10
0.10
0.86
3.00
2.95
4.90
3.00
2.95
0.51
0.51
0.15
0.15
0.31
0.41
± Tolerance
Max
±0.05
±0.08
±0.10
±0.10
±0.15
±0.10
±0.10
±0.13
±0.13
+0.15 to -0.08
+0.15 to -0.08
±0.08
±0.08
Symbol
b
b1
c
c1
θ1
θ2
θ3
L
L1
aaa
bbb
ccc
e
S
Millimeters
0.33
0.30
0.18
0.15
3.0º
12.0º
12.0º
0.55
0.95 BSC
0.10
0.08
0.25
.65 BSC
.525 BSC
± Tolerance
+0.07 to -0.08
±0.05
±0.05
+0.03 to -0.02
±3.0º
±3.0º
±3.0º
±0.15
Notes:
1. All dimensions are in millimeters (angle in degrees), unless otherwise specified.
2. Datums B and C to be determined at datum plane H.
3. Dimensions D and E1 are to be determined at datum plane H.
4. Dimensions D2 and E2 are for top package and D and E1 are for bottom package.
5. Cross section A-A to be determined at 0.13 to 0.25mm from the lead tip.
6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.
7. Dimension E1 and E2 do not include interlead flash or protrusion.
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Revision 1.5
11 - 13
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