AS1106 데이터 시트보기 (PDF) - austriamicrosystems AG

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AS1106

8-Digit LED Display Drivers

austriamicrosystems AG 

AS1106, AS1107

Data Sheet

austriamicrosystems

4 Absolute Maximum Ratings

Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical

Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 1. Absolute Maximum Ratings

Parameter

Min

Max Units

Notes

Voltage (with respect to GND)

VDD

DIN, CLK, LOAD/CSN

All other pins

Current

DIG 0:DIG 7 Sink Current

SEG A:SEG G, SEG DP

-0.3

7

V

-0.3

7

V

-0.3

7 or

VDD + 0.3

V

500

mA

100

mA

Continuous Power Dissipation

(TAMB = +85ºC)

Narrow plastic DIP

Wide SOIC

1066 mW

941 mW

Derate 13.3mW/ºC

above +70ºC

Derate 11.8mW/ºC

above +70ºC

AS1106PL, AS1106WL

0

Operating Temperature

Ranges (TMIN toTMAX)

AS1106PE, AS1106WE

-40

AS1107PL, AS1107WL

0

Storage Temperature Range

-65

+70

ºC

+85

ºC

+70

ºC

+150 ºC

Package Body Temperature (Wide SOIC) 1

+260

ºC

Soldering Temperature (Narrow DIP) 2

+260

ºC

Humidity

5

85

%

Non-condensing

Electrostatic Discharge 3

Digital outputs

All other pins

Latch-Up Immunity 4

1000

1000

±200

V

V

mA

All pins except AS1106

pin 14: ±180 mA

1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020C

“Moisture/Reflow Sensitivity Classification for non-hermetic Solid State Surface Mount Devices”.

2. Specified according JESD22-B106 “Resistance to Soldering Temperature for Through-Hole Mounted Devices”.

3. Norm: MIL 883 E method 3015.

4. Norm: JEDEC 17.

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