AS1115-BSST(2012) 데이터 시트보기 (PDF) - austriamicrosystems AG
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AS1115-BSST Datasheet PDF : 26 Pages
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AS1115
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Electrical Parameters
lid VDD to GND
-0.3
7
All other pins to GND
-0.3
7 or
VDD + 0.3
DIG0:DIG7 Sink Current
500
a SEGA:SEGG, SEGDP Sink Current
100
v Input Current (latch-up immunity)
-100
100
ill Electrostatic Discharge
Electrostatic Discharge HBM
+/- 1
Thermal Information
t 88
Thermal Resistance ΘJA
G s 30.5
Temperature Ranges and Storage Conditions
A t Junction Temperature
+150
Storage Temperature Range
-55
+150
ms ten Package Body Temperature
+260
a n Humidity non-condensing
Technical co Moisture Sensitive Level
5
85
1
Units
V
V
mA
mA
mA
kV
°C/W
°C/W
ºC
ºC
ºC
%
Comments
Norm: JEDEC 78
Norm: MIL 883 E method 3015
on PCB, QSOP-24 package
on PCB, TQFN(4x4)-24 package
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-
020“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Represents a max. floor life time of unlimited
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