AS1116-BSST(2009) 데이터 시트보기 (PDF) - austriamicrosystems AG

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AS1116-BSST
(Rev.:2009)

64 LED Driver with Detailed Error Detection

austriamicrosystems AG 

AS1116

Datasheet - Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max Units

Notes

Input Voltage Range

VDD to GND

All other pins to GND

-0.3

7

V

-0.3

7 or

VDD + 0.3

V

Current

DIG0:DIG7 Sink Current

SEGA:SEGG, SEGDP

500

mA

100

mA

Humidity

5

85

%

Non-condensing

Electrostatic Discharge

Digital outputs

All other pins

Latch-Up Immunity

Thermal Resistance ΘJA

Ambient Temperature

1000

1000

±100

88

30.5

-40

+85

V

V

mA

ºC/W

ºC/W

ºC

Norm: MIL 833 E method 3015

EIA/JESD78

on PCB, QSOP-24 package

on PCB, TQFN(4x4)-24 package

Storage Temperature

-55

150

ºC

Package Body Temperature

+260

The reflow peak soldering

temperature (body temperature)

specified is in accordance with IPC/

JEDEC J-STD-020D “Moisture/

ºC Reflow Sensitivity Classification for

Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).

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