ASM1506C 데이터 시트보기 (PDF) - APLUS INTEGRATED CIRCUITS
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ASM1506C Datasheet PDF : 7 Pages
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1.4 Bonding Diagram
ASM1506C
48K x 10 bit ROM
Y= 1770+120(um)
1
2
ASM1506C
11
CHIP SIZE: X= 1550+120(um) , Y= 1770+120(um)
10
3
4
5
6
7
8
9
X= 1550+120(um)
Substrate must be connected to GND.
ASM1506C Pad Location
PAD # PAD Name
X
1 RA3
-664.92
2 RA2
-664.92
3 RA1
-662.64
4 RA0
-468.24
5 OSC
-281.04
6 GND
-111.72
CHIP SIZE: X= 1550+120(um) , Y= 1770+120(um)
Y
PAD # PAD Name
X
Y
-476.16
7
TEST_PAD
105.44
-800.84
-604.28
8
COUT
303.96
-800.84
-800.84
9
VDD
683.04
-800.84
-800.84 10 RB0
664.92
-599.84
-800.84 11 RB1
664.92
-481.44
-800.84
5
Rev 1.0
2002/9/22
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