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ASM25512C 데이터 시트보기 (PDF) - APLUS INTEGRATED CIRCUITS

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ASM25512C Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
1.4 Bonding Diagram
ASM25512C
(192K x 10 bit) x 4-Block ROM
Y= 4470 + 80 (um)
ASM25512C
CHIP SIZE: X= 3090 + 80 (um), Y= 4470 + 80 (um)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
X= 3090 + 80 (um)
Substrate must be connected to GND.
ASM25512C Pad Location
PAD # PAD Name
1 VDD3
2 PRC1
3 PRC0
4 PRA3
5 PRA2
6 PRA1
7 PRA0/RESET
8 OSC
9 VDD1
10 COUT
X
-1445.96
-1325.24
-1202.92
-1080.6
-958.28
-835.96
-713.64
-591.32
-416.04
-162.24
Chip Size: X= 3090 + 80 (um) ,
Y
PAD # PAD Name
-2123.6 11 GND1
-2123.6 12 GND2
-2123.6 13 TEST
-2123.6 14 VDD2
-2123.6 15 PRB0
-2123.6 16 PRB1
-2123.6 17 PRB2
-2123.6 18 PRB3
-2123.6 19 PRC2
-2123.6 20 PRC3
21 GND3
Y= 4470 + 80 (um)
X
Y
38.72 -2118.08
118.72 -2118.08
319.68
-2123.6
575.32
-2123.6
714.48
-2123.6
836.8
-2123.6
959.12
-2123.6
1081.44
-2123.6
1203.76
-2123.6
1326.08
-2123.6
1449.36
-2123.6
5
Rev 1.1
2002/10/29

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