AT24CS01(2014) 데이터 시트보기 (PDF) - Atmel Corporation

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AT24CS01
(Rev.:2014)

I2C-Compatible (2-wire) Serial EEPROM with a Unique, Factory Programmed 128-bit Serial Number 1-Kbit (128 x 8), 2-Kbit (256 x 8)

Atmel Corporation 

13.

Ordering Information

Additional package types that are not listed may be available. Please contact Atmel for more details.

Atmel Ordering Code(1)

Finish

Package

Voltage

Operation Range

AT24CS01-SSHM-B(2)

8S1

AT24CS01-SSHM-T(3)

AT24CS01-XHM-B(2)

AT24CS01-XHM-T(3)

AT24CS01-MAHM-T(3)

NiPdAu

(Lead-free/Halogen-free)

8X

8MA2

1.7V to 5.5V

Industrial Temperature

(-40C to +85C)

AT24CS01-STUM-T(3)

5TS1

AT24CS01-WWU11M(4)

—

Wafer Sale

AT24CS02-SSHM-B(2)

AT24CS02-SSHM-T(3)

AT24CS02-XHM-B(2)

AT24CS02-XHM-T(3)

AT24CS02-MAHM-T(3)

AT24CS02-STUM-T(3)

AT24CS02-WWU11M(4)

8S1

NiPdAu

8X

(Lead-free/Halogen-free)

8MA2

5TS1

—

Wafer Sale

1.7V to 5.5V

Industrial Temperature

(-40C to +85C)

Notes: 1. Consistent with the general semiconductor market trend, Atmel will supply devices with either gold or copper

bond wires to increase manufacturing flexibility and to ensure a long-term continuity of supply. There is no

difference in product quality, reliability, or performance between the two variations.

2. B = Bulk delivery in tubes.

 SOIC and TSSOP = 100 units per tube.

3. T = Tape and Reel

 SOIC = 4,000 units per reel.

 TSSOP, UDFN, and SOT23 = 5,000 units per reel.

4. For Wafer sales, please contact Atmel Sales.

8S1

8X

8MA2

5TS1

Package Type

8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP)

8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Dual No Lead (UDFN)

5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)

AT24CS01/02 [DATASHEET] 17

Atmel-8815D-SEEPROM-AT24CS01-02-Datasheet_082014

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