ATA6629(2014) 데이터 시트보기 (PDF) - Atmel Corporation
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ATA6629 Datasheet PDF : 26 Pages
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7. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Supply voltage VS
Pulse time ≤ 500ms
Ta = 25°C
Output current IVCC ≤ 85mA
Pulse time ≤ 2 min
Ta = 25°C
Output current IVCC ≤ 85mA
Logic pins (RxD, TxD, EN, NRES)
Output current NRES
LIN
- DC voltage
VCC
- DC voltage
ESD according to IBEE LIN EMC
Test specification 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND
ESD HBM following STM5.1
with 1.5 kΩ/100 pF
- Pin VS, LIN to GND
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
CDM ESD STM 5.3.1
Machine model ESD
AEC-Q100-RevF(003)
Junction temperature
Storage temperature
Symbol
VS
VS
VS
INRES
Tj
Ts
Min.
–0.3
–0.3
–27
–0.3
±8
±6
±3
±750
±200
–40
–55
Typ.
Max.
Unit
+40
V
+40
V
27
V
+5.5
V
+2
mA
+40
V
+5.5
V
KV
KV
KV
V
V
+150
°C
+150
°C
8. Thermal Characteristics
Parameters
Thermal resistance junction to ambient
(free air)
Special heat sink at GND (pin 3) on PCB
Thermal shutdown of VCC regulator
Thermal shutdown of LIN output
Thermal shutdown hysteresis
Symbol
Rthja
Rthja
TVCCoff
TLINoff
Thys
Min.
150
150
Typ.
80
160
160
10
Max.
145
170
170
Unit
K/W
K/W
°C
°C
°C
16 ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
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