ATA7609
286 mm
303 mm
GND
CEXT
GND
GND
IIN
GND
ATA7609
Die Size: 1000 mm x 910 mm
Die Thickness: 178 mm
Backside metal thickness: 5 mm
Pad Opening: 100 mm x 100 mm
unless otherwise noted
Pad Pitch 150 mm unless otherwise
noted
VOUT
VOUT
VEE
VEE
GND
170 mm
140 mm
286 mm
Figure 2: Die Size and Layout
Table 1: Pad Description
PAD DESCRIPTION
COMMENTS
VEE Negative Supply Voltage
-5.2 V
GND Ground
IIN TIA Input
Photocurrent input
CEXT Connection for an External Capacitor Sets the low frequency cutoff
VOUT Non-inverted Output Voltage
Logical '1' with optical input
VOUT Inverted Output Voltage
Logical '0' with optical input
2
PRELIMINARY DATA SHEET - Rev 1.0
10/2002