AWC6325P9 데이터 시트보기 (PDF) - ANADIGICS

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AWC6325P9

HELP3E Dual-band Cellular & PCS CDMA 3.4 V Linear Power Amplifier Module

ANADIGICS 

AWC6325

PCB BOARD Design GuidELINES

Refer to Figure 7 for the recommended PCB metal

design, soldermask design, and stencil print patterns

when assembling with ANADIGICS modules.

It is important to note that the PCB metal design is

dependent upon several factors: the electrical and

thermal performance requirements of the product,

and the PCB-to-device interconnect pattern. The

PCB metal design recommendations primarily deal

with the PCB-to-device interconnection. Specific

board-level electrical and thermal performance re-

quirements will be dictated by the physical geometry

of the specific application and are the responsibility

of the end product manufacturer.

Figure 7: PCB Board Design Guidelines

9

PRELIMINARY DATA SHEET - Rev 1.3

05/2012

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