AWT6111 데이터 시트보기 (PDF) - ANADIGICS

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AWT6111

CDMA/AMPS Power Amplifier

ANADIGICS 

Minimum Bench Requirements

The following minimum equipment is required for

proper power amplifier operation.

1. Spectrum Analyzer

2. Three power supplies

3. CDMA function generator

4. RF filter (Surface Acoustic Wave-SAW)

5. Isolator

6. RF power meter

7. Coupler(s)

Turn On Procedures

Upon receiving the amplifier, the characterization

sheet should be reviewed for the appropriate bias

conditions. Review the evaluation board drawing

prior to connection of the proper bias pins on the

application board.

AWT6111

Other Recommendations

In order to maximize performance in a CDMA system,

the AWT6111 achieves full output power (+28.5dBm

in digital mode and +31dBm in analog mode) while

operating in low power mode. This minimizes

quiescent current (47 mA typical) and eliminates

the need for mode switching between high and low

power or between analog and digital modes of

operation. Applying logic low (0 V) to both VREF and

VMODE pins, places the amplifier in shutdown

(standby) mode. To minimize external switch

requirements, the VREF and VMODE lines can be tied

together. IMODE is only ~300 uA, therefore tying it to

the VREF line doesn’t significantly increase the

current requirements on the switched line.

1. Be sure to connect the amplifier to 50 Ω RF in/

out cables.

2. No RF power should be applied to the amplifier

prior to biasing.

3. Attach VCC1 and VCC2 first; then VREF and VMODE.

4. Turn the VREF supply to +2.85 V. Observe current

draw of approximately 5 mA.

5. Turn on the VCC1 and VCC2 supply to +3.5 V.

Observe current of ~100 mA from VCC supply.

6. Turn on RF power applying +5 dBm. Gradually

increase until the appropriate power level is

obtained from the output (28.5 - 29 dBm in

digital mode, 31 dBm in analog mode).

7. Perform measurements.

Layout Considerations

A sufficient number of holes (QTY 12 - 0.2mm

diameter plated through hole) should be placed

under the module in order to channel the heat

properly. In addition, contact should be made

between the PA slug located under the amplifier and

the board. For hand assembly of the board, place

sufficient bonding paste so that contact is made

between the PA and ground. For large volume

assembly, please refer to the solder profile

recommendations application note. For RF in and

out provide 50 Ω transmission lines.

Application Note - Rev 0

3

04/2002

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