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APL5158-12BC-TRL 데이터 시트보기 (PDF) - Anpec Electronics

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APL5158-12BC-TRL
Anpec
Anpec Electronics Anpec
APL5158-12BC-TRL Datasheet PDF : 15 Pages
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APL5158
Application Information
Thermal Protection
Thermal protection limits total power dissipation in the
APL5158. When the junction temperature exceeds
TJ=+150°C, the thermal sensor generate a logic sig-
nal to turn off the pass transistor and let IC to cool.
When the IC’s junction temperature cools by 15°C,
the thermal sensor will turn the pass transistor on
again, resulting in a pulsed output during continuous
thermal protection. Thermal protection is designed to
protect the IC in the event of fault conditions. For
continual operation, do not exceed the absolute maxi-
mum junction temperature rating of TJ=+150°C.
Operating Region and Power Dissi-
pation
The thermal resistance of the case and circuit board,
ambient and junction air temperature, and the rate of
air flow all control the APL5158’s maximum power
dissipation. The power dissipation across the device
is P = IOUT (VIN-VOUT). The maximum power dissipa-
tion is:
PMAX = (TJ-TA) / (θJB +θBA)
where TJ-TA is the temperature difference between
the junction and ambient air. θJB(or θJB) is the thermal
resistance of the package, θBA is the thermal resis-
tance through the printed circuit board, copper
traces, and other materials to the surrounding air.
The GND pin of the APL5158 provide an electrical
connection to ground and channeling heat away.
Connect the GND pin to ground using a large pad or
ground plane as a heatsink, it can improve maximize
thermal dissipation.
Copyright ANPEC Electronics Corp.
11
Rev. A.5 - Aug., 2004
www.anpec.com.tw

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