CAT24C32C4CTR(2018) 데이터 시트보기 (PDF) - ON Semiconductor
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CAT24C32C4CTR Datasheet PDF : 15 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP5, 1.34x0.91
CASE 567JQ
ISSUE A
DATE 09 JUN 2015
PIN A1
REFERENCE
E
ÈÈ
2X
0.10 C
AB
D
2X
0.10 C TOP VIEW
DIE COAT
(OPTIONAL)
A3
A2
DETAIL A
0.10 C
0.05 C A1
NOTE 3
SIDE VIEW
A2
A
C
SEATING
PLANE
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DIMENSION b IS MEASURED AT THE MAXIMUM
BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A
−−− 0.35
A1 0.08 0.12
A2
0.23 REF
A3 0.025 REF
b 0.16 0.20
D
1.34 BSC
E
0.91 BSC
e
0.40 BSC
e1
0.693 BSC
GENERIC
MARKING DIAGRAM*
5X b
0.05 C A B
0.03 C
C
B
A
e
e1
123
BOTTOM VIEW
XYW
X = Specific Device Code
Y = Year
W = Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.69
PITCH
5X
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON82067F
DESCRIPTION: WLCSP5, 1.34X0.91
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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