935260061118 데이터 시트보기 (PDF) - Philips Electronics
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935260061118 Datasheet PDF : 24 Pages
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
4 Coil Specifications
The HITAG 1 chip module has to be connected to a coil whose parameters are briefly described
in the following.
Equivalent circuit of the transponder
Xpc
Rpc
Cp
Uc
Cchip
Rchip
Uc
...
fres
...
Xpc
...
Rpc
...
Cp
...
Cchip
...
Rchip
...
fresc
...
Lpc
=
Lpc
=
Cchip
=
Rpc
>
fresc
>
voltage at the connection pads
resonant frequency of the transponder
parallel reactance of the coil (f = 125 kHz)
parallel resistance of the coil (f = 125 kHz)
parasitic capacitance of the package
capacitance of the chip (Uc > 4 Vpp)
resistance of the chip
self resonant frequency of the coil
Xpc/2πf (f = 125 kHz)
7.72 mH ± x % (Cp = 0, x depends on the coil production process)
210 pF ± 10 %
45 k[
750 kHz
Note: The parasitic capacitance of the package (Cp) must be considered.
( ) ( ) fres =
2π
1
(Cchip + Cp).Lpc
= 125 kHz
⇒
Lpc
=
1
2πfres 2 Cchip + Cp
Typical values for Cp
hot laminated cards: Cp = 1.5 pF
moulded tags:
Cp = 6.0 pF
Ht1moa3.doc/HS
Page 10 of 24
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